Ram memory 8GB kit (2 x 4GB) DDR3 PC3-12800,1600MHz, 204 PIN SODIMM for laptops

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Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, DDR3L-1600, and DDR3L-1866". May 2013 . Retrieved 2019-09-08. DDR3L VDD/VDDQ requirements - Power Supply: DDR3L operation = 1.283 V to 1.45 V; DDR3 operation = 1.425 V to 1.575 V .. Once initialized for DDR3L operation, DDR3 operation may only be used if the device is in reset while VDD and VDDQ are changed for DDR3 operation Release 4 of the DDR3 Serial Presence Detect (SPD) document (SPD4_01_02_11) adds support for Load Reduction DIMMs and also for 16b-SO-DIMMs and 32b-SO-DIMMs. Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, DDR3L-1600, and DDR3L-1866". May 2013 . Retrieved 2019-09-08. While the typical latencies for a JEDEC DDR2-800 device were 5-5-5-15 (12.5ns), some standard latencies for JEDEC DDR3 devices include 7-7-7-20 for DDR3-1066 (13.125ns) and 8-8-8-24 for DDR3-1333 (12ns). In February 2005, Samsung introduced the first prototype DDR3 memory chip. Samsung played a major role in the development and standardisation of DDR3. [2] [3] In May 2005, Desi Rhoden, chairman of the JEDEC committee, stated that DDR3 had been under development for "about 3 years". [4]

Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, DDR3L-1600, and DDR3L-1866 (JESD79-3-1A.01) DocMemory (2007-02-21). "Memory Module Picture 2007". Archived from the original on 2017-06-06 . Retrieved 2022-01-05. Shilov, Anton (August 16, 2010). "Next-Generation DDR4 Memory to Reach 4.266GHz – Report". XbitLabs.com. Archived from the original on December 19, 2010 . Retrieved 2011-01-03. Intel Corporation officially introduced the eXtreme Memory Profile ( XMP) Specification on March 23, 2007, to enable enthusiast performance extensions to the traditional JEDEC SPD specifications for DDR3 SDRAM. [28] Variants [ edit ] Both FBDIMM (fully buffered) and LRDIMM (load reduced) memory types are designed primarily to control the amount of electric current flowing to and from the memory chips at any given time. They are not compatible with registered/buffered memory, and motherboards that require them usually will not accept any other kind of memory.

Fractional frequencies are normally rounded down, but rounding up to 667 is common because of the exact number being 666 2⁄ 3 and rounding to the nearest whole number. Some manufacturers also round to a certain precision or round up instead. For example, PC3-10666 memory could be listed as PC3-10600 or PC3-10700. [23] Pc3 10600 vs. pc3 10666 What's the difference – New-System-Build, Tomshardware.com , retrieved 2012-01-23 According to JEDEC, [11] :111 1.575 volts should be considered the absolute maximum when memory stability is the foremost consideration, such as in servers or other mission-critical devices. In addition, JEDEC states that memory modules must withstand up to 1.80 volts [a] before incurring permanent damage, although they are not required to function correctly at that level. [11] :109

Non-registered (a.k.a. " unbuffered") RAM may be identified by an additional U in the designation. [30]

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DDR2 PC2-4200 (commonly referred to as DDR2-533) memory is DDR2 designed for use in systems with a 266MHz front-side bus (providing a 533MT/s data transfer rate). The "4200" refers to the module's bandwidth (the maximum amount of data it can transfer each second), which is 4200MB/s, or 4.2GB/s. Power consumption of individual SDRAM chips (or, by extension, DIMMs) varies based on many factors, including speed, type of usage, voltage, etc. Dell's Power Advisor calculates that 4GB ECC DDR1333 RDIMMs use about 4W each. [20] By contrast, a more modern mainstream desktop-oriented part 8GB, DDR3/1600 DIMM, is rated at 2.58W, despite being significantly faster. [21] Modules [ edit ] List of standard DDR3 SDRAM modules

In addition to bandwidth designations (e.g. DDR3-800D), and capacity variants, modules can be one of the following: As with earlier memory generations, faster DDR3 memory became available after the release of the initial versions. DDR3-2000 memory with 9-9-9-28 latency (9ns) was available in time to coincide with the Intel Core i7 release in late 2008, [19] while later developments made DDR3-2400 widely available (with CL 9–12cycles = 7.5–10ns), and speeds up to DDR3-3200 available (with CL 13cycles = 8.125ns). SPD (Serial Presence Detect), from JEDEC standard No. 21-C (JESD21C: JEDEC configurations for solid state memories) Bryan, Gardiner (April 17, 2007). "DDR3 Memory Won't Be Mainstream Until 2009". ExtremeTech.com . Retrieved 2009-06-17.DDR3-xxx denotes data transfer rate, and describes DDR chips, whereas PC3-xxxx denotes theoretical bandwidth (with the last two digits truncated), and is used to describe assembled DIMMs. Bandwidth is calculated by taking transfers per second and multiplying by eight. This is because DDR3 memory modules transfer data on a bus that is 64 data bits wide, and since a byte comprises 8 bits, this equates to 8 bytes of data per transfer. a b "What is LR-DIMM, LRDIMM Memory? (Load-Reduce DIMM)". simmtester.com. Archived from the original on 2014-09-03 . Retrieved 2014-08-29. JEDEC Solid State Technology Association announced the publication of JEDEC DDR3L on July 26, 2010 [35] and the DDR3U in October 2011. [36] Feature summary [ edit ] Components [ edit ] Salisbury, Andy (2009-01-20). "New 50nm Process Will Make DDR3 Faster and Cheaper This Year". Pcgamer . Retrieved 2009-06-17.

Another benefit is its prefetch buffer, which is 8-burst-deep. In contrast, the prefetch buffer of DDR2 is 4-burst-deep, and the prefetch buffer of DDR is 2-burst-deep. This advantage is an enabling technology in DDR3's transfer speed. The DDR3 standard permits DRAM chip capacities of up to 8 gigabits (Gbit), and up to four ranks of 64 bits each for a total maximum of 16 gigabytes (GB) per DDR3 DIMM. Because of a hardware limitation not fixed until Ivy Bridge-E in 2013, most older Intel CPUs only support up to 4-Gbit chips for 8GB DIMMs (Intel's Core 2 DDR3 chipsets only support up to 2 Gbit). All AMD CPUs correctly support the full specification for 16GB DDR3 DIMMs. [1] History [ edit ] IDF: "DDR3 won't catch up with DDR2 during 2009" ". pcpro.co.uk. 19 August 2008. Archived from the original on 2009-04-02 . Retrieved 2009-06-17. Alternative naming: DDR3 modules are often incorrectly labeled with the prefix PC (instead of PC3), for marketing reasons, followed by the data-rate. Under this convention PC3-10600 is listed as PC1333. [25] Serial presence detect [ edit ]Specification Will Encourage Lower Power Consumption for Countless Consumer Electronics, Networking and Computer Products". McCloskey, Alan, Research: DDR FAQ, archived from the original on 2007-11-12 , retrieved 2007-10-18 JEDEC Solid State Technology Association announced the publication of Release 4 of the DDR3 Serial Presence Detect (SPD) document on September 1, 2011. [27] XMP extension [ edit ] DDR3 does use the same electric signaling standard as DDR and DDR2, Stub Series Terminated Logic, albeit at different timings and voltages. Specifically, DDR3 uses SSTL_15. [13]